Tin Solder Without Flux For Copper Installations Diameter 3.00 250g Pcs

technical data:wire diameter: 3.0capacity [g]: 250 lead-free soldering alloys based on tin are used mainly in electronics electrical engineering and construction.these are most often alloys of the sn-ag-cu sn-cu and sn-ag type with alloying elements content of up to several%. These alloys are most often used where the presence of lead in the solder is undesirable or prohibited.in construction the sn97cu3 solder is most often used for soldering copper installations.physicochemical propertieslead-free solders ensure good weld quality. These alloys are characterized by a slightly higher melting point approximately 30°c and slightly worse wetting of soldered surfaces than sn-pb alloys.however the use of appropriate fluxes significantly improves the soldering process and the quality of the weld.silver as an alloying element in lead-free solders increases the wetting rate and improves resistance to thermal fatigue.the addition of cu improves the soldering of electrical connections.**illustrative photo